The standard ranges SHANYUAN builds and quotes against. Use this page to shortlist options before the RFQ — final values are always fixed by the released drawing, which is the contract document.
C11000 copper (ETP, electrolytic tough pitch) is the standard conductor: 101% IACS minimum, good formability, and the reference for our ampacity chart. 6101 aluminum is the lightweight alternative at roughly 40% higher resistance for the same section — it needs larger cross-section or more layers, and bolted joints follow aluminum-specific torque and creep rules. The copper vs aluminum note works through the arithmetic.
Standard laminated stacks run 1 to 6+ layers. A typical EV or ESS stack is 2-4 layers (DC+, DC- and sense or interlock); converter DC-links often use 3-6 layers with dedicated shield layers. Each conductor layer is punched copper with dielectric between layers and at the outer faces, bonded in one hot-press cycle. Layer count affects current sharing, inductance and thickness — all three are reviewed at DFM. The power electronics busbar page shows the standard families.
Three dielectrics cover the standard range: PET film for cost-effective insulation at moderate voltages and temperatures; Nomex where the thermal class must be higher; and DLF constructions for high-voltage or partial-discharge-critical designs. Thickness is selected from voltage class and mechanical handling, typically 0.25-0.76 mm per layer. If the application requires UL 94 V-0, specify it — the material choice is confirmed in the DFM response. Creepage and clearance rules are in the design guide.
Standard terminals: M6 and M8 threaded studs for bolted cable and bus connections; blade terminals for plug-in and rack systems; welded tabs for battery module and cell-group connections. Solder and press-fit options exist on request. Terminal plating matches the conductor finish — tin 5-15 µm standard, silver for high-current interfaces. Layout spacing, torque and creepage at studs are part of the DFM check.
Reasonable standard tolerances: overall length and width ±0.5 mm, hole positions ±0.3 mm, stack thickness ±0.2-0.3 mm, terminal height ±0.5 mm. Tighter values are achievable on critical features with capability study and cost impact. Bending radii follow the conductor material — copper bends tighter than aluminum for the same thickness. If your drawing has tight tolerances on several features, our DFM review will tell you which are free and which cost.
Standard per-lot tests: hipot (dielectric withstand at the agreed voltage, typically 2-3 kV for 800-1500 V class), insulation resistance, dimensional and continuity. Where the application needs it: partial discharge testing per IEC 60270 with a 10 pC acceptance level, thermal cycling, and salt-spray for harsh environments. Test scope is fixed at design freeze and documented per lot — see the quality documents page for what ships with the order.
SHANYUAN ratings use a 30 °C temperature rise above ambient as the reference basis, consistent with IEC 61439-style rating practice. Derating factors apply for enclosure, altitude, harmonics and parallel-bar spacing; the ampacity calculator applies the main ones. If your application runs at a different rise or in a sealed enclosure, state it in the inquiry — it changes the cross-section recommendation.
Send your specification and get a technical and commercial response within one business day.
