9 modelos técnicos de esta familia: cada uno totalmente a medida.
Ensamblaje de barra laminada soldada para distribución de alta corriente, con terminales p
Barra laminada para inversores de tracción de vehículo eléctrico, con terminales de pala p
Barra laminada multipala para conexiones de banco de condensadores en convertidores de pot
Barra laminada larga de enlace DC con terminales de pala para diseños de inversor de baja
Juego de barras laminadas para módulos de potencia IGBT, con palas terminales emparejadas
Ensamblaje compacto de barra laminada con terminales de pala para distribución de perfil b
Barra laminada para convertidores de potencia con palas laterales y espiga central de mont
Sándwich multicapa de cobre prensado en caliente que cancela la inductancia parásita para
Barra de aparamenta de baja tensión a medida dirigida a cuadros conformes a NEC, reformas
| Capability | Range |
|---|---|
| Conductor layers | 1–6+ (custom stack-ups) |
| Conductor material | C11000 copper (standard), aluminum on request |
| Plating | Tin (standard) |
| Dielectrics | PET, Nomex, epoxy (DLF) |
| Terminal types | M6/M8 threaded studs, blade tabs, screw terminals, welded tabs, fused links |
| Current rating | Per design, up to ~1000 A |
| Mounting | Integrated brackets, standoffs, edge seals |
| Material | Standard options |
|---|---|
| Conductors | C11000 copper as standard; aluminum available on request |
| Dielectrics | PET, Nomex and epoxy (DLF) films, selected by voltage class and operating temperature |
| Plating | Tin finish for corrosion protection and joint solderability |
Power electronics busbars sit inside the commutation loop — between DC-link capacitors and switching modules — where every nanohenry of stray inductance counts. Three reference markets:
DC links and phase legs for renewable inverters rated toward 1500 VDC, with partial discharge controlled by layout and dielectric choice.
Low-inductance links from DC bus capacitors to IGBT stacks in VFDs, holding switching losses and voltage overshoot in check.
Low-profile distribution laminates feeding rectifiers and server cabinets, with controlled impedance and no wiring errors.
DC links are built with adjacent positive and negative planes to cancel loop inductance; the dielectric thickness between them is the main lever. Capacitor-to-module geometry is locked at DFM before any tooling is cut.
Blade and screw terminals are positioned to the exact pitch of your IGBT or SiC module pins, with weld zones sized for vibration life. Send the module part number and we align the tab pattern to it.
400 V class designs standard on PET; 800 V and higher move to Nomex or epoxy (DLF) with wider edge sealing. Read the low-inductance busbar design rules before release, and see inverter DC links for reference circuits.
De la revisión de especificaciones a piezas enviadas y probadas: un proveedor responsable.
Controles de hipot, aislamiento, dimensiones, visual y continuidad por lote, con registros dimensionales y eléctricos entregados con su envío a pedido.
Construcción, selección dieléctrica y fundamentos de capacidad.
Leer la guía de diseñoRespuestas directas del equipo de ingeniería.
Send the current profile and terminal types — we will recommend a configuration from this family or quote a custom part.
